Manufacturing method changed from blow-molding (blown items) to stamp molding (pressed items).
・Softening point improved greatly to 670°C for pressed items.
・Dimensional accuracy also improved (due to stamp molds).
・Products are RoHS compliant.
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Board hole φ0.8 | MOQ:50pcs | ||||||||||||||||||||||||||||||||
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・Can be mounted in series at a 2.54 mm pitch.
・Easy to conduct testing since beads are tall even in spots where components are packed tightly. ・Choose from 10 colors of beads. ・PC board mounting hole diameter: φ0.8, φ1.0 |