Manufacturing method changed from blow-molding (blown items) to stamp molding (pressed items).
・Softening point improved greatly to 670°C for pressed items.
・Dimensional accuracy also improved (due to stamp molds).
・Products are RoHS compliant.
(Board hole φ1.0 |
MOQ:50pcs | ||||||||||||||||||||||||||||||||
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(Board hole φ1.0 |
MOQ:50pcs | ||||||||||||||||||||||||||||||||
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・Heads have inverted triangular shape to off er secure hooking onto with signal check oscilloprobes.
・Can be mounted with uniform height due to leg projections. ・Easy to conduct testing since beads are tall even in spots where components are packed tightly. ・Enlarge PC board holes (φ1.3 or more) for lower mounting. ・PC board mounting hole diameter φ1.0 |